the bismaleimide ( bmi ) / allylphenyl compound ( apc ) / epoxide ( ep ) resin systems with high-performance prepared by multicomponent copolymerization and their progress of preparation and application were reviewed with 32 references in this paper 摘要介紹和評述了雙馬來酰亞胺(bmi)/烯丙基苯基化合物(apc)/環(huán)氧化合物(ep)高性能多元共聚樹脂的化學結構與固化反應,以及在耐熱電絕緣材料、高性能覆銅板、半導體封裝材料和耐熱膠粘劑等領域的研究與應用進展情況。